As part of our continued growth, we are seeking a Senior/Principal Software Applications Engineer (BLE) for Bluetooth Product Line for the Application Engineering APAC (Sales) Department to provide hands-on software support for DA14xxx Bluetooth product line, working as part of the APAC & Japan AE team. This role will work alongside the local FAE teams and provide turnkey support for key customers and the wider market in APAC & Japan.

Please send your English resume to: wujingjian.gao@diasemi.com

(仅接受英文简历）

The Role
Working in the Sales Department based in Shanghai, China, you will:

• Support customers on their application software / profile implementation on SmartBond (and roadmap products). Ability to provide deep level hands-on customer support in elements such as debugging, code porting, code optimisation, peripheral utilization, clocking, memory configuration customers own profile development, tool optimization and general software/hardware support of MCU, testing and optimizing for manufacture.

• Customise reference designs from the Business unit to local customer needs.

• Create proof of concepts and demo’s (including developing software).

• Support where necessary customers modifying/developing custom profiles.

• Provide feedback to the product line on suggestions to improve deliverables: tools / device / architecture /reference designs.

• Support Dialog sales, FAE and distributor channel in opportunities as directed by AE team leader.

• Provide APAC customers with Production Test support.

• Build localised Bluetooth stack knowledge for support of the region.

• Support the online support model (through the Dialog Forums).

• Some on-site customer travel will be required.

What We Are Looking For

• At least 5 years of working experience with bachelor degree or 3 years of working experience with master degree.

• Solid Embedded MCU software knowledge - 100% necessity.

• Thoroughly experienced with toolchains (e.g. Keil/IAR etc..), debuggers & general toolchains.

• Experience in MCU SW /Register Architecture (Cortex –M preferred).

• Understanding of high-level embedded C.

• Confident in ability to help customers modify/optimise/debug.

• Experience in developing with embedded C from ground up OR.

• Extensive experience in similar programming environment is required.

• Experience in taking MCU based products through design to production.

• RTOS experience (free RTOS, Android, Ubuntu, WinCe etc).

• Knowledge of Bluetooth stack and advantage.

• Solid MCU Hardware Knowledge – 100% necessity.

• Knowledgeable in MCU hardware peripherals.

• Clocking & Timers / input & output / XTAL / UART, SPI, I2C/ memory utilisation/ DMA etc.

• General wireless market knowledge is a strong advantage, especially Bluetooth.

Why Join Us?
We passionately believe that working at Dialog, you will be joining the brightest, most diverse and ambitious talent in the Semiconductor Industry. We are proud to have won numerous awards and designs, including exclusive patents that have assisted us to years of double-digit growth in this highly competitive industry. With growth planned for the coming years, the opportunity for talent to progress at Dialog could not be greater. We are fast becoming the employer of choice within microelectronics chip design, power management solutions, short-range wireless connectivity and AC/DC power conversion.

关于Dialog半导体公司
Dialog半导体公司是推动物联网和工业4.0应用发展的领先集成电路（IC）供应商。Dialog的解决方案是今天众多领先移动设备和不断提升性能和生产力的推动技术中不可缺少的部分。使智能手机功率效率更高、缩短充电时间、实现对家电随时随地的控制、连接下一代可穿戴设备，Dialog数十年的技术经验和世界领先的创新实力将帮助设备制造商引领未来。

Dialog采用无晶圆厂运营模式，作为雇主积极承担社会责任，开展各项活动造福员工、社区、其他相关利益方和自然环境。Dialog 半导体公司总部位于伦敦附近，在全球设有销售、研发和营销办事处。2019年，Dialog实现了约14.2亿美元营业收入，并一直是发展最快的欧洲上市半导体公司之一。目前，公司在全球约有2100名员工。公司在德国法兰克福（FWB: DLG）证券交易所（Regulated Market, Prime Standard, ISIN GB0059822006）上市，其股票是德国TecDax技术股指数的成份股。