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JEDEC Package Outline Spec 索引
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为了方便大家快速找到对应的资料，建立了这个索引表，建议直接在论坛里搜索 Spec No.
| Spec No. | Content |
| MO054 | Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin |
| MO055 | Registration - Ceramic Single-In-Line Package (SIP) Family |
| MO056 | Registration -Ceramic .025 inch Center Chip Carrier |
| MO057 | Registration -Ceramic .020 inch Center Chip Carrier |
| MO059 | Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max |
| MO062 | Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch |
| MO063 | Registration -Plastic Small Outline J-Lead (SOJ) .350 inch Wide Body, .050 inch Lead Spacing, 26.20 Pin |
| MO065 | Registration - Plastic Small Outline J-Lead (SOJ) .300 inch Wide Body Family, 0.050 Lead Spacing, 24 and 26 Pins |
| MO066 | Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline) |
| MO067 | Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline) |
| MO068 | Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. |
| MO069 | Registration - Plastic Quad Flatpack .025 inch Lead Spacing (Gullwing). |
| MO070 | Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family |
| MO071 | Registration - Plastic Thin Lead Package Family Square (Gullwing) |
| MS001 | Standard - Dual-In-Line Plastic Family .300 inch Row Spacing. R-PDIP-T |
| MS002 | Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH |
| MS003 | Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH |
| MS004 | Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH |
| MS005 | Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH |
| MS006 | Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A |
| MS007 | Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH |
| MS008 | Standard - .050 inch Center Lead Chip Carrier, Type B. Variations BA-BH |
| MS009 | Standard - .040 inch Center Leadless Chip Carrier Packages. Variations AA-AJ |
| MS010 | Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD |
| MS011 | Standard - Plastic DIP .600 inch Row Spacing, 48 Lead. Addition of Variation AD |
| MS012 | Standard - Plastic Dual Small Outline (SO) Family, Gull Wing, 1.27 mm Pitch Package |
| MS013 | Standard - Very Thick Profile, Plastic Small Outline (SO) Family, 1.27 mm pitch, 7.50 mm (.300 inch) Body Width. B1R-PDSO.SOP.SOIC |
| MS014 | Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ |
| MS015 | Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing |
| MS016 | Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm(0.050 inch) Lead Spacing, Rectangular |
| MS017 | Standard - Ceramic PGA .100 inch Pitch Cavity Down |
| MS018 | Standard - Square Plastic Chip Carrier Family, (1.27 mm).050 inch Pitch |
| MS019 | Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .300 inch Row Spacing. R-PDIP-T |
| MS020 | Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .600 inch Row Spacing. R-PDIP-T |
| MS021 | Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T |
| MS022 | Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm |
| MS023 | Standard - Plastic SOJ, .300 inch Body, .050 inch Lead Spacing |
| MS024 | Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family |
| MS025 | Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle |
| MS026 | Standard - Low.Thin Profile Plastic Quad Flat Package, 2.00 mm Footprint, Optional Heat |
| MS027 | Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J |
| MS028 | Standard - Addition of Rectangular BGA Variations to BGA Family |
| MS029 | Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint |
| MS030 | Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing |
| MS031 | Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing |
| MS032 | Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing |
| MS033 | Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch |
| MS034 | Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA.PBGA |
| MS072 | Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE |
| MS073 | Registration - Ceramic Top Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing |
| MS074 | Registration - Ceramic Bottom Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing |
| MS075 | Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square |
| MS076 | Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier SO Series, Rectangular |
| MS077 | Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. |
| MS078 | Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. |
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